01/07/2024-IEEE FLEPS 2024

Location: Tampere, Finland

Title: Integrated Piezoresistivity and Frequency Modulation for High-Sensitivity Printed Capacitive Strain Sensing

I presented my research at the IEEE FLEPS 2024 conference in Tampere, Finland.

At the conference, I shared my work on “Advancing Wireless Passive Strain Sensor for Structural Integrity Monitoring” and “Integrated Piezoresistivity and Frequency Modulation for High-Sensitivity Printed Capacitive Strain Sensing.”

It was a valuable opportunity to discuss printable and flexible sensing technologies with the IEEE FLEPS community.